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倒裝焊 Flip Chip Bonder

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更新時間：2024-06-11 09:16:47瀏覽次數(shù)：94次

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產(chǎn)品簡介

FlipChipBonder特點(diǎn)：Chip-to-WaferFlipchipbonderforNCF-TCBprocessCapableofhigh-speed

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Flip Chip Bonder特點(diǎn)：

Chip-to-Wafer Flip chip bonder for NCF-TCB process

Capable of high-speed, high-precision flip chip bonding by adopting probe camera

technology and linear motor

High precision control of both bond head force and Z position

Shinkawa’s NRS technology reduced vibration that obstructs fine pitch bonding

High throughput achieved by short heating and cooling with pulse heater

Automatic product-type changeover function with capability to bond up to 4 different product-type

chips enables handling of 2.5D and 3D stack packaging

Capable of handling each plunge-up method and thin die pickup

Capable of handling 12-inch chip wafer and base wafer

Molten solder detection function and high-precision Z control reduce damage on devices

(under low force mode)

Process monitoring and management function securing stable quality and process portability

Flip Chip Bonder規(guī)格參數(shù)：

Product Name	Flip Chip Bonder
Model	LFB-2301
Bonding Method	Pulse heat thermocompression
Bonding Accuracy	±2μm (3σ) by Shinkawa’s standard condition
Bonding Force	1 - 300N ※Capable of selecting bond force control method at bonding process However, it is not capable of switching over between low force control and high force control in the identical bond profile ?Low force Control mode：1 - 50N in 0.1N increments ?High force Control mode：10 - 300N in 1N increments
Bonding Tool Setting Temperature	RT - 400℃ (in 1℃ increments　pulse heat）
Bonding Stage Setting Temperature	RT - 150℃ (in 1℃ increments　pulse heat）
Chip Size	□2 - 20mm　t＝0.05-0.7mm
Chip Wafer Size	φ200mm, φ300mm
Base Wafer Size	φ200mm, φ300mm
Process	NCF-TCB：Option available：NCP-TCB, Flux-TCB
Option Available	Communication Interface　SECS Ⅰ/ SECS Ⅱ, HSMS, GEM
Utilities	Electricity：Three-phase AC 200V±5％　50/60Hz (if other voltage, consults us)
	Power Consumption：5.0kW Maximum
	CDA：570kPa (5.7kgf/cm２) 250L/min　Connection：φ10　Tube　1spot
	Vacuum：Below -74kPa (-550mmHg) (gage)　Connection：φ10　Tube　3spots
Physical Dimensions and Mass	Approx. 3,292W×1,521D×1,701H mm　Approx 3,000kg (excludes monitor display, signal tower and load port)