詳細(xì)信息

詳細(xì)介紹：

產(chǎn)品特點(diǎn)：
1. 概述主要用于對(duì)表面有油污的單/多晶硅片進(jìn)行超聲波振蕩清洗.
2. 組成設(shè)備基本由六-十個(gè)清洗槽構(gòu)成。
3. 控制設(shè)備操作方便,清洗工作過程帶時(shí)間控制.
4. 裝片每槽可裝載多個(gè)花籃，晶片放在清洗花籃內(nèi)（25片/籃）。
5.超聲波振蕩清洗過程水溫可根據(jù)需要設(shè)置加熱管,清洗功率與超聲頻率可根據(jù)需要調(diào)整.
6. 槽體材料可選用PTFE、PVDF、PP和不銹鋼等.
7. PLC控制，觸摸屏操作面板.
8. 多種工作模式：全自動(dòng)、半自動(dòng)、手動(dòng)等.
9. 實(shí)時(shí)狀態(tài)顯示及故障報(bào)警
Product features：
1. Summary mainly for useing ultrasonic cleaning oscillation to wash the single / polysilicon has oil on the surface.
2. This Equipment was composed by 6- 10 cleaning groove.
3. Control equipment is easy to operate, and the washing process has the Time Control
4. Every tank can Loading more baskets which has Chip in(25/basket)
5. The water temperature of cleaning process can be set up heating pipe according to the request, Ultrasonic
cleaning power and frequency may need to be adjusted.
6. Groove material may choose to use PTFE, PVDF, PP and stainless steel, etc.
7. PLC control, and touch screen operation panel
8. Multiple operating modes: automatic, semi-automatic, manual, etc.
9. Real-time status display and Failure Alarm
適用范圍：太陽能硅片，半導(dǎo)體，電子零件等。
Scope： Solar wafers, semiconductor, electronics and other industries.